![ALPHA HiTech 249742.0011GM](https://assets.testequity.com/te1/product-images/medium/CU31-3150.jpg)
Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
ALPHA HiTech CU13-3150 is a one-component, low temperature thermal cure capillary underfill designed for lower temperature applications for thermally sensitive parts. ALPHA HiTech CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process.
Brand:Â ALPHA HiTech
Alternate Product Number:Â CU13-3150
Series:Â CU13-3050 Series