• Low curing temperature - requires a minimum of 85°C for 20 minutes
  
• Excellent adhesion & drop shock on Heat Sensitive Substrates
  
• Provides good adhesion on LCP, Metal, and Nylon
  
• Low RBO (Resin Bleed out) performance
  
• Can also be used as damming material
  
• Halogen-free

ALPHA HiTech AD13-9620B Low Temperature Adhesive is designed for bonding temperature sensitive devices to a variety of plastic and metal surfaces. This adhesive has excellent adhesion and drop shock on heat sensitive substrates.