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DeWeyl Tool
DeWeyl Tool

DeWeyl Tool 20097 M-PAC-1/8-2.5-VG/ CG-M HWT9142-1 w/Seriali

Our Part #572IE0097

Mfr Part #20097

DeWeyl Tool 20097
DeWeyl Tool
DeWeyl Tool

DeWeyl Tool 20097 M-PAC-1/8-2.5-VG/ CG-M HWT9142-1 w/Seriali

Our Part #572IE0097

Condition:New

Mfr Part #20097

$240.00EACH
Qty:Price:Savings
1$240.00
5$228.00Save 5%
10$220.80Save 8%
20$211.20Save 12%

DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.

Brand: DeWeyl Tool
Application Method: Ultrasonic bonding
Material: Ceramic
Note: DeWeyl order ID: M-PAC-1/8-2.5-VG/CG-M HWT9142-1 w/Serialization
$240.00EACH
Qty:Price:Savings
1$240.00
5$228.00Save 5%
10$220.80Save 8%
20$211.20Save 12%