• Increased solder volume
• Improved drop test results
• Fewer issues with flux residue
• Reduced rework
• Improved fillet shape and volume

Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components, make this increasingly difficult. Solder Fortification® Preforms can provide the solution for these challenging issues. Solder Fortification® Preforms are generally rectangle- or disc-shaped pieces of alloyed metal that do not contain any flux.