• Low-voiding on QFN, BGA, and CSP components
• Exceptional head-in-pillow resistance
• High transfer efficiency and low variation through small apertures (≤0.66 AR)
• Eliminates the graping phenomenon
• Outstanding RF shield metallization wetting

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium10.1 Pb-Free Solder Paste

Indium10.1 Solder Paste Best All-around Halogen-containing Paste

Leading Print Performance on Miniaturized Components

Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics industry to replace Pb-bearing solders. Indium10.1 offers exceptional stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium10.1 virtually eliminates incomplete coalescence (graping) of small deposits and the head-in-pillow defect. Indium10.1 also offers extremely low, large ground-plane voiding found in QFN components.

The oxidation-inhibiting properties of Indium10.1 solder pastes promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 solder paste makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.

Indium10.1 solder paste enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 solder paste provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.

Indium10.1 works best in applications that require:

• Wetting performance on difficult to solder or oxidized metallizations
• Low BTC voiding
• Outstanding HIP performance

Key Feautures:

• Lowest levels of voiding for QFNs, BGAs, and CSPs
• Oxidation inhibition promotes complete coalescence after long reflow profiles
• Excellent HIP and graping performance