• Halogen-free per EN14582 test method
• Low BGA, CSP, QFN voiding
• One of our most stable solder pastes
• High transfer efficiency through small apertures (≤0.66AR)
• Eliminates hot and cold slump
• High oxidation resistance
• Wets well to oxidized BGA and pad surfaces
• Excellent soldering performance under high-temperature and long reflow processes
• Clear, probe testable flux residue
• Compatible with SnPb alloys

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium8.9HF Pb-Free Solder Paste

Looking for an SMT Solder Paste that has Superior Printing and Voiding Performance?

• Want enhanced electrical reliability to ensure your product life reliability?
• Need it to be stable for room temperature storage and have a long stencil life?

We have your solution!

Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9HF minimizes false failures in ICT. It is one of our lowest voiding pastes. Under optimal process conditions, Indium8.9HF:

• Delivers excellent response-to-pause even after being left on the stencil for 60 hours

• Maintains excellent printing and reflow performance after remaining at room temperature for one month

• Demonstrates consistent printing performance for up to 12 months when refrigerated

Key feautures:

• Low bottom termination component (BTC) voiding
• Enhanced post reflow flux residue electrical reliability
• Strong oxidation barrier promotes complete coalescence and HIP resistanceStrong oxidation barrier promotes complete coalescence
• Resists flux spread to prevent surfaces from oxidizing