CircuitMedic 310-1002 Wire Dots, .394" (10.0 mm) Square, 210/Pkg
Our Part #246SO1002
Mfr Part #310-1002
CircuitMedic 310-1002 Wire Dots, .394" (10.0 mm) Square, 210/Pkg
Our Part #246SO1002
Condition:New
Mfr Part #310-1002
- Description
- Specifications
- Documents
310-1002 Wire Dots, .394" (10.0 mm) Square
Clean up your act when bonding wires. Wire Dots make the job of bonding jumper wires neat and fast.
Wire Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high-performance, electronics grade permanent pressure-sensitive adhesive. The result is a highly conformable, high-strength bond.
The adhesive on Wire Dots is commonly used for graphic attachment and membrane switch applications because it has excellent long-term quality, consistency, and durability. Wire Dots perform well after exposure to high humidity, UV, immersion in water, and hot/cold cycles.
Wire Dots will hold secure after exposure to numerous chemicals, including cleaning solutions/sprays, saponifiers, mild acids, and alkalies. And will hold secure through a typical circuit board hot water wash.
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Material Properties |
|
|---|---|
|
Cover Film |
Clear Polyester Film 1.0 mil (.025 mm) Thick |
|
Adhesive |
High performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP) |
|
Relative High Temperature Operating Ranges |
Short term (minutes/hours) 400°F (204°C) Long term (days/weeks) 300°F (149°C) |
|
Application |
Specifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic markets. |
|
Shelf Life |
Minimum 12 months. |
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Physical and Thermal Properties |
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|
Property |
Typical Value |
Unit |
Test Method |
|
Peel Strength 72 hrs @ 22 C |
84 |
0z./in. |
ASTM D3330 Modified |
|
Static Shear Strength 72 F (22 C) / 1000g |
>10,000 |
min |
ASTM D3654 |
|
Tensile Strength (Yield) 72 F (22 C) |
>2600 |
psi |
ASTM D2370 |
|
Elongation |
100 |
% |
ASTM D2370 |
|
Thermal Conductivity |
0.17 |
w/m-k |
ASTM C518 |
|
Coefficient of Thermal Expansion |
5.5 x 10 -4 |
m/m/C |
ASTM D696 25-175C |
|
Electrical Properties |
|||
|
Property |
Typical Value |
Unit |
Test Method |
|
Dielectric Strength |
1700 |
volts/mil |
ASTM D149 |
|
Dielectric Constant 25 C, 1 kHz |
3.4 |
------ |
ASTM D150 |
|
Dissipation Factor 25 C, 1 kHz |
0.018 |
------ |
ASTM D150 |
|
Surface Resistivity - Adhesive Layer |
>1 x 10 14 |
ohm/square |
ASTM D257 |
|
Surface Resistivity - Polymer Film Layer |
>1 x 10 16 |
ohm/square |
ASTM D257 |
|
Volume Resistivity - Adhesive Layer |
>1 x 10 15 |
ohm/cm |
ASTM D257 |
|
Volume Resistivity - Polymer Film Layer |
>1 x 10 18 |
ohm/cm |
ASTM D257 |
|
Insulation/Moisture Resistance - Adhesive Layer |
>1 x 10 11 |
ohm |
MIL-I-46058C (100 VDC 60 sec) |
|
Insulation/Moisture Resistance - Polymer Film Layer |
>1 x 10 12 |
ohm |
MIL-I-46058C (100 VDC 60 sec) |
|
Voltage Breakdown |
3500 |
volts |
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