• High electrical conductivity
  
• Creates strong permanent electrical connections
  
• No mixing, unlimited working time
  
• Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
  
• Room temperature storage
  
• Suitable for automated dispensing

It is smooth, non-sagging and thixotropic, so it is excellent for use on vertical surfaces and for gap-filling. It is also useful for potting electronics in enclosures with gaps where a non-thixotropic encapsulant would flow through.