• Provides consistent performance after room temperature or cold storage, and throughout the assembly process
• Halogen-free per EN14582 test method
• Low BGA, CSP, QFN voiding
• High transfer efficiency through small apertures (≤0.66AR)
• Eliminates hot and cold slump
• High oxidation resistance
• Compatible with SnPb alloys

Indium8.9HF Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Image shown is a representation of actual product