• Excellent NWO performance
• Very wide reflow profile window under both air and nitrogen
• Excellent HIP performance
• Excellent soldering performance and process yield
• Excellent wetting to all fresh and aged surface finishes, including, but not limited to: OSP, Immersion Ag, Immersion Sn & ENIG.
• Low-bridging, tombstoning, and solder beading
• Low-voiding in all joints including QFN and BGA assemblies
• Clear post-reflow residue

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

Indium10.8HF Solder Paste

Indium10.8HF Pb-Free Solder Paste Addresses Non-Wet Opens (NWOs)

Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium10.8HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium10.8HF is versatile, with a balanced set of properties:

• Meets leading OEM standards for
  non-wet open resistance
• Oxidation barrier technology delivers strong resistance to:
• Head-in-pillow defects
• Graping (non-coalescence of powder particles)
• Strong surface oxide cleaning and pad wetting during reflow ramp
• Low voiding on BGSs, CSPs, and QFNs
• Outstanding printing performance with high transfer efficiency and low variability
• Excellent response-to-pause

Indium10.8HF works best in applications that require:

• Warpage induced defect elimination; such as non-wet open and HIP. These are typically BGA microprocessors with thin core substrates and high IO counts that are found in PCs and tablets.