- Description
- Specifications
- Documents
- Ribbon bonding wedge for gold and aluminum wire
- For manual and semi-automatic bonders
- Vertical feed deep access
- Front/Back radius: .0015 x .005
- Foot type: Cross groove
- Ribbon size: .0005 thickness x .003 width
- Bond length: .0020
- Slot width: .0035 x .0037
- Foot finish: Matte (FR, BR & Bond flat)
- A10 Double Flat
- A8D option for enhanced wire control
DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.
Brand:Â DeWeyl Tool
Angle: with A8D, Hole 45°
Application Method:Â Ultrasonic bonding
Compatibility:Â The A8D option is not suitable for use with F&K Delvotec and Hesse Mechatronics machines
Material:Â Ceramic
Note:Â Deweyl order ID: MRCSVG-1/16-750-45-CG-.5X3-2-M-A8D-A10-SW.0035/.0037-A10 DOUBLE FLAT
Series:Â RCS-V Series
Shank Diameter:Â 1/16
Shank Type:Â Tungsten Carbide