• Features & Benefits
  
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B for ROM1
• Particle size Type 3 (80% min. between 25-45 µm)
• No-clean
• Excellent 12 mil (0.30 mm) fine pitch printing capability
• Long operational life—non-slumping
• Good wettability
• Halogen and lead-free

4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.

These leaded solders achieve a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.