- Description
- Specifications
- Documents
- Circuit Frames are used to replace damaged surface mount pads, lands, and conductors. Circuit Frames have a dry-film adhesive backing that is cured in 30 seconds using heat from a bonding iron.
- The replaced pad, land, or conductor has a bond strength equal to the original, and no messy liquid epoxies are used for bonding.
- This reliable IPC-recommended procedure meets the highest conformance level for this type of circuit board rework or repair. For over 40 years, Circuit Frames have been used by thousands of commercial, medical, and military manufacturers around the globe.
- One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life.
Brand:Â CircuitMedic
Base Material:Â Rolled annealed copper foil .0014" (.036 mm) thick
Frame Size:Â 2.25 x 1.50"
Adhesive Back:Â Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties.
Adhesive Material:Â B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Bonding Temperature: 475°F
Bonding Time:Â 30 sec.
For Use With:Â 115-3210; 115-3220; 115-2801; 115-2802; 115-2803; 115-2804; 115-2805
Plating:Â 0001" (.0025 mm) Bright Tin (Lead Free)