• Non-flowing
• Room temp cure
• High tensile strength and elongation
• Enhanced thermal stability
• MIL-A-46146 Group II/III, TY I
• No mixing required
• RT cure, no ovens required
• Faster in-line processing with optional heat acceleration
• Can be considered for uses with Mil Spec requirements
• Can be considered for uses needing special high temperature stability

Sealing openings in modules and housings, Adding mechanical stability to individual components, Assembly of components on PWBs, Sealing in and around wired and electrical leads, Yoke assembly

DOWSIL™ 3145 RTV one-part moisture cure adhesives are generally cured at room temperature and in an environment of 30 to 80 percent relative humidity eliminating the need for curing ovens and the associated costs of energy and capital. Greater than 90 percent of full physical properties should be attained within 24 to 72 hours and varies according to product. Faster manufacturing through-put can be achieved since the adhesive and component can be handled in much shorter times of about 10 to 120 minutes, depending on the adhesive selected and the amount applied.

These adhesives are not typically used in highly confined spaces or where a deep section cure is required as they generally cure from the exposed surface inward at a rate of 0.25 inch per seven days. Cure progresses from the outer exposed surface and is dependent on the moisture in the air. Working time is generally a few minutes to an hour for these products until a surface skin begins to form. Mild heat below 60°C (140°F) may be used to increase through-put by accelerating the cure.

DOWSIL™ silicone adhesives retain their original physical and electrical properties over a broad range of operating conditions which enhance the reliability of and service life of devices. The stable chemistry and versatile processing options of these adhesives offer benefits for a variety of electronics needs from increasing component safety and reliability, reducing total cost or increasing the performance envelope of devices or modules. Underwriters Laboratory (UL) 94 recognition is based on minimum thickness requirements.

Application Benefits

• Primerless Adhesion: Yes
• Use: Battery Pack, Boards and Assemblies, Components, Housings
• Water Resistant: Yes

Certifications and Standards

• Regulatory Approvals: MIL Spec

Product Use and Formulating

• Cure Characteristics: Room Temperature Long Working Time > 10 min
• Cure Type: Alkoxy Cure, Condensation Cure, Methoxy Cure
• Number of Parts: 1 part
• Room Temperature Cure: 48 Hours
• Tack-Free Time-50% RH: 55 Minutes

Typical Properties

• Adhesion to: Glass, Nylon 6/6
• Color: Clear, Gray
• Dielectric Constant at 100 Hz: 2.83
• Dielectric Constant at 100 kHz: 2.83
• Dielectric Strength: 500 volts per mil v/mil
• Dissipation Factor at 100 Hz: < 0.001
• Durometer - Shore A: 45
• Elongation: 6.6
• Linear CTE: 370 um/m/Deg C
• Nonflowable: Yes
• Shelf Life: 360 Days
• Specific Gravity: 1.1 @ 25°C
• Tensile Strength: 940 psi
• Volume Resistivity: 4.4e+014 Ω・cm