• Liquidus 220°C (428°F)
• Compatible with all Flux Types
• Excellent Wetting Speed
• Excellent Solderability and Spreading
• Reduced Bridging Versus Sn-Cu Alloys
• Manufactured with AIM Electropure™ Technology
• Complies with IPC J-STD-006

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering. AIM Electropure™ SAC305 bar solder offers reduced dross production and superior wetting and fluidity as compared to other solder brands. AIM’s SAC305 bar solder is alloyed using our proprietary Electropure™ method resulting in a low drossing, high wetting solder. AIM Electropure™ SAC305 may be used with all existing lead-free compatible equipment, processes, coatings, and flux chemistries.