![DeWeyl Tool 20097](https://assets.testequity.com/te1/product-images/medium/572IE0097.01.jpg)
$240.00EACH
Qty: | Price: | Savings |
---|---|---|
1 | $240.00 | |
5 | $228.00 | Save 5% |
10 | $220.80 | Save 8% |
20 | $211.20 | Save 12% |
- Description
- Specifications
DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.
Brand:Â DeWeyl Tool
Application Method:Â Ultrasonic bonding
Material:Â Ceramic
Note:Â DeWeyl order ID: M-PAC-1/8-2.5-VG/CG-M HWT9142-1 w/Serialization
$240.00EACH
Qty: | Price: | Savings |
---|---|---|
1 | $240.00 | |
5 | $228.00 | Save 5% |
10 | $220.80 | Save 8% |
20 | $211.20 | Save 12% |