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- Description
- Specifications
- Documents
- Ribbon bonding wedge for gold and aluminum wire
- For automatic bonders
- Front/Back radius: .0010 x .0010
- Foot type: Cross groove
- Ribbon size: .0001 thickness x .003 width
- Bond length: .0030
- Slot width: .0035 x .0038
- Foot finish: Matte (FR, BR & Bond flat)
- A4 Front Step .375, A9 Back Chamfer, S1 Option
- Polished funnel entrance & exit slot
DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.
Brand:Â DeWeyl Tool
Angle: Hole 55°
Application Method:Â Ultrasonic bonding
Compatibility:Â Palomar (Hughes) Hesse Mechatronics bonding and welding machines
Length:Â 1"
Material:Â Ceramic
Note:Â DeWeyl order ID: MRNHE-1/16-1"-55-CG-1X3-3-M-A4-A9-S1
Series:Â RNH Series
Shank Diameter:Â 1/16
Shank Type:Â Tungsten Carbide