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DeWeyl Tool
DeWeyl Tool

DeWeyl Tool 40768 Wire Bonding Wedge, Ceramic, SW .0035x.0038, Series RNH

Our Part #572IE768

Mfr Part #40768

DeWeyl Tool 40768
DeWeyl Tool
DeWeyl Tool

DeWeyl Tool 40768 Wire Bonding Wedge, Ceramic, SW .0035x.0038, Series RNH

Our Part #572IE768

Condition:New

Mfr Part #40768

$418.00EACH
Qty:Price:Savings
1$418.00
2$397.10Save 5%
5$376.20Save 10%
  • Ribbon bonding wedge for gold and aluminum wire
  • For automatic bonders
  • Front/Back radius: .0010 x .0010
  • Foot type: Cross groove
  • Ribbon size: .0001 thickness x .003 width
  • Bond length: .0030
  • Slot width: .0035 x .0038
  • Foot finish: Matte (FR, BR & Bond flat)
  • A4 Front Step .375, A9 Back Chamfer, S1 Option
  • Polished funnel entrance & exit slot

DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.

Brand: DeWeyl Tool
Angle: Hole 55°
Application Method: Ultrasonic bonding
Compatibility: Palomar (Hughes) Hesse Mechatronics bonding and welding machines
Length: 1"
Material: Ceramic
Note: DeWeyl order ID: MRNHE-1/16-1"-55-CG-1X3-3-M-A4-A9-S1
Series: RNH Series
Shank Diameter: 1/16
Shank Type: Tungsten Carbide
$418.00EACH
Qty:Price:Savings
1$418.00
2$397.10Save 5%
5$376.20Save 10%