HF2W shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including OSP-Cu, ENIG and Silver.

This material is available with standard tin lead Sn63 eutectic alloy and HARIMA proprietary anti-tombstoning 63S4 alloy.

Features and Benefits:

• Water washable, tin-lead solder paste
• Halogen-free flux passes IPC-TM-650 2.3.34/EN14582, flux class '0', J-STD004B ORM0
• Suitable for fine pitch, high speed printing
• Excellent resistance to hot slump @ 150°C
• Good humidity resistance to solder balling
• Excellent solderability in air
• Available with anti-tombstoning alloy technology for improved resistance to tombstone defects
• Residues designed for easy removal when cleaned with water
• Residues designed for easy removal when cleaned with deionized water