• Low-maintenance—does not require frequent solder pot analysis or pot balancing alloys
• Low-cost—does not contain Ag
• Low-dross formation—lower than SAC and SnCu-based alloys
• Less copper erosion than SAC305
• Compatible with other SnCu-based alloys (ex. Sn100C)—can be added to existing SnCu-based alloys without any adverse reactions
• Available as a solder bar for wave soldering and cored wire for rework applications

Sn995 Low-Maintenance, Low-Cost, Pb-Free Soldering Alloy is a cobalt-doped SnCu alloy that provides a low-cost alternative to traditional SAC305 and a low-maintenance alternative to popular low-Ag lead-free alloys like Sn100C. In addition to its low cost, it produces smoother, shinier joints and lower dross than SAC305 and other SnCu-based alloys.
Sn995 bar and wire will comply with the requirements of ASTM B-32, J-STD-006 (formerly QQS-571F), and JIS-Z-3282. Each batch of solder alloy used to manufacture Indium Corporation’s bar solder and chips is analyzed for metallic composition and impurities.